Published By National Aeronautics and Space Administration
Issued about 9 years ago
US
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Summary
Description
The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500:C in extreme environments of space exploration. The Phase I program will demonstrate a reliable direct bond copper (DBC) process for Si3N4 substrates, develop high current carrying hermetic feedthroughs, an innovative transient liquid phase (TLP) die attach, and a monometallic wire bonding capable of reliable operation above 500:C; and fabricate and test a hermetic single-chip module.