Published By Federal Laboratory Consortium
Issued over 9 years ago
Summary
Description
Description: HMDS (hexamethyldisilzane) promotes photoresist adhesion by creating a bond between the resist and silicon. The silizanes bond to the silicon in the wafer while the methyls bond with the photoresist. Vapor priming allows for HMDS application in a monolayer and reduces the chance of contamination. Specifications / Capabilities: Quality of Coating Surface dehydration and subsequent vapor priming results in chemical bonding to surface hydroxyl ions, not weakly bound surface moisture Reesulting coatings are repeatable and stable for extended periods Efficiency of Chemical Usage Uses less than 5 ml to coat up to 200 wafers System uses pure HMDS so there is no possibility of variation due to changes in carrier concentration Waste Disposal Virtually no waste - no liquid solvents or residues to dispose of Flexibility of Substrate Size and Shape Any size and shape substrate can be treated with equal efficiency up to 16" There are no issues with flow effects or substrate topology due to use of vapor Flexibility of Type of Substrate Delicate or difficult substrates can be accommodated with simple temperature or recipie changes With no substrate movement during priming, there is no risk of breakage or other damage HMDS is stored in the system under vacuum Chemical does not degrade from exposure to moisture in the air Operators are not exposed to fumes from the HMDS or carrier solvent