Datové sady / An Intelligent Strain Gauge with Debond Detection and Temperature Compensation Project


An Intelligent Strain Gauge with Debond Detection and Temperature Compensation Project

Vydavatel National Aeronautics and Space Administration

Datum vydání před téměř 10 roky

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<p>To improve instruments functionality in a harsh rocket propulsion test environment, this project developed an intelligent strain gauge.  The initial design for this project was a novel foil strain gauge with the capability to measure strain and temperature (Type 1).  The novel foil strain gauge pattern features the integration of a silicon-diode temperature sensor and a self-heating element. The silicon-diode sensor provides the gauge temperature for performing real-time temperature compensation algorithms. The silicon-diode temperature sensor was used in the initial gauge pattern due to its enhanced abilities, but after refinement, resistive temperature element was then embedded into a second gauge pattern (Type 2). Then, the debond detection function was tested by monitoring the temperature of the gauge while the gauge was heated and cooled. The temperature signature (rate of heating/cooling) from the gauge was analyzed for both bonded and debonded gauges. Finally, a small control circuit was created with the capability to self-execute a bond integrity check, and perform real-time temperature compensation was also added. By combining the control circuit with the special gauge the smart gauge was converted into a fully functioning intelligent sensor system.</p>