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High Thermal Conductivity Functionally Graded Heat Sinks for High Power Packaging Project

Summary

Type of release
a one-off release of a single dataset

Data Licence
Not Applicable

Content Licence
Creative Commons CCZero

Verification
automatically awarded

Release Date
9 April 2015
Modified Date
8 July 2015
Publishers
National Aeronautics and Space Administration
Keywords
completed, glenn-research-center, project
Identifier
high-thermal-conductivity-functionally-graded-heat-sinks-for-high-power-packaging-project
Landing Page
http://techport.nasa.gov/view/5249
Maintainers
Juan Sepulveda hq-techport@mail.nasa.gov
Language
en-US

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Description

This NASA SBIR Phase I program proposes the development of a high thermal conductivity (400 W/mK), low coefficient of thermal expansion (7-10 ppm/?K), and light weight (3-4 g/cm3) functionally graded material (FGM) heat sinks for microelectronic packaging applications. The uniquely defined ?FGM concept? pursued in this project uses a metallic package base that consists of a light metal matrix composite material to provide low thermal expansion and a high thermal conductivity functional core to cool the high power semiconductor die. The thermal performance of the heat sink is doubled by using the high thermal conductivity functional core bonded through the body of the heat sink.

General Information

Legal Information

This dataset has been created by US Government which means it is required to be in the public domain. However US copyright law only allows open access by US citizens, we have assumed the data is equivalently licensed as CC0 for the rest of the world as this is in the spirit of the US Government’s Open Data policy.

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