Vydavatel Federal Laboratory Consortium
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Description: CORAL Name: Dicing Saw Need Description Specifications / Capabilities: Pieces up to 8" wafers Approved training required Scientific Opportunities / Applications: Full wafer dicing Auto cutting and semi-auto cutting modes Used to dice silicon, sapphire, ceramic, metals, Pyrex, glass, epoxy substrates Maximum material thickness < 0.50 in Used for dicing photomasks, wafers, creating channels, troughs, gratings, ramps and sample preparation